Semiconductor device with heat-dissipating lead-frame and process of manufacturing same
US6396133B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 3, 1998 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Sep 3, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device assembly is provided. The semiconductor device assembly includes a heat-dissipating lead-frame, a semiconductor chip coupled to the heat-dissipating lead-frame, and an insulating package encapsulating the semiconductor chip and an internal portion of the heat-dissipating lead-frame. The heat-dissipating lead-frame is constructed of a single material. A process is provided for fabricating a semiconductor device assembly. The process includes providing a lead-frame that includes a paddle with external and internal portions, providing a semiconductor chip, thermally coupling the semiconductor chip to the internal portion. The process also includes encapsulating the semiconductor chip and the internal portion in an insulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.