Patent · US Expired

Method and apparatus for electrical characterization of an integrated circuit package using a vertical probe station

US6396296B1 · kind B1 · utility

106Cited by
11References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 15, 2000
Grant dateMay 28, 2002
Priority date—
Expiry dateMay 15, 2020

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R31/2896
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

An integrated circuit package test station supports an integrated circuit package under test in a vertical orientation thereby allowing simultaneous access to both sides of the package. Probe assemblies are utilized on both sides of the package to increase the accuracy, efficiency, and simplicity of performing electrical characterization of the IC package. The IC package holder as well as the probe assemblies are adjustably positioned to allow accurate and precise measurements of through-package electrical characteristics. To aid in positioning the test equipment, a dual-display image magnification system is used which provides images from both sides of the IC package simultaneously.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.