Nhon T. Do
6Patents
4h-index
6Co-inventors
36Inventor score
Filing activity: Mar 15, 2000 → Jan 19, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6396296B1 | Method and apparatus for electrical characterization of an integrated circuit package using a vertical probe station | Physics | 106 | Expired |
| US6512675B1 | Heat sink grounded to a grounded package lid | Electricity | 21 | Expired |
| US6384618B1 | Chip scale electrical test fixture with isolation plate having an angled test hole | Physics | 11 | Expired |
| US6531774B1 | Chip scale electrical test fixture with isolation plate having a recess | Electricity | 5 | Expired |
| US6476625B1 | Method for determining coplanarity of electrical contact of BGA type packages prior to electrical characterization | Physics | 4 | Expired |
| US6424140B1 | Chip scale electrical test fixture | Physics | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.