Patent · US Expired

Micromechanical component protected from environmental influences

US6401544B2 · kind B2 · utility

2Cited by

4References

11Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Robert Aigner · Winter Garden, US
Christofer Hierold · Munich, DE
Hergen Kapels · Neubiberg, DE
Stefan Kolb · Unterschleißheim, DE
Dieter Maier-Schneider · Borgo San Lazzaro, DE
Klaus-Gunter Oppermann · Holzkirchen, DE
Hans-Jörg Timme · Ottobrunn, DE
Thomas Scheiter · Munich, DE
Wolfgang Werner · Hersbruck, DE

Key dates

Filing date	Feb 27, 2001
Grant date	Jun 11, 2002
Priority date	—
Expiry date	Feb 27, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method is disclosed for producing a micromechanical component. The micromechanical component has sensor holes, wherein at least one component protective layer and/or a spacer coating is applied on the component before separating the wafer into chips. The component protective layer sealingly covers at least the walls of the holes extending parallel to the surface of the wafer and perpendicular to the surface of the wafer and the spacer coating sealingly covers at least the walls of the holes extending parallel to the surface of the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.