Micro electro-mechanical system sensor with selective encapsulation and method therefor
US6401545B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Jan 25, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Selective encapsulation of a micro electro-mechanical pressure sensor provides for protection of the wire bands (140) through encapsulation while permitting the pressure sensor diaphragm (121) to be exposed to ambient pressure without encumbrance or obstruction. Selective encapsulation is made possible by the construction of a protective dam (150) around the outer perimeter of a pressure sensor diaphragm (121) to form a wire bond cavity region between the protective dam (150) and the device housing (105). The wire bond cavity may be encapsulated with an encapsulation gel (160) or by a vent cap (170). Alternatively, the protective dam (150) may be formed by a glass frit pattern (152) bonding a cap wafer (151) to a device wafer (125) and then dicing the two-wafer combination into individual dies with protective dams attached.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.