Kyujin Jung
8Patents
8h-index
10Co-inventors
55Inventor score
Filing activity: Jan 5, 2000 → Dec 19, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6342730B1 | Low-pin-count chip package and manufacturing method thereof | Electricity | 106 | Expired |
| US6261864A | Low-pin-count chip package and manufacturing method thereof | Electricity | 96 | Expired |
| US6528893B2 | Low-pin-count chip package and manufacturing method thereof | Electricity | 89 | Expired |
| US6401545B1 | Micro electro-mechanical system sensor with selective encapsulation and method therefor | Electricity | 84 | Expired |
| US6495909B2 | Low-pin-count chip package and manufacturing method thereof | Electricity | 80 | Expired |
| US6333252A | Low-pin-count chip package and manufacturing method thereof | Electricity | 60 | Expired |
| US6861295B2 | Low-pin-count chip package and manufacturing method thereof | Electricity | 32 | Expired |
| US6242284A | Method for packaging a semiconductor chip | Electricity | 20 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.