Polishing method for wafer and holding plate
US6402594B1 · kind B1 · utility
22Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1999 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Dec 29, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing method for wafer, comprises the steps of; adhering a wafer to a wafer adhesion part of a holding plate through a wax, and rubbing the wafer with a polishing pad, wherein grooves are formed on the wafer adhesion part and extend to the outside of the wafer adhesion part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.