Powdered metallic sheet method for deposition of substrate conductors
US6402866B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1999 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Sep 30, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided for forming metal circuit patterns and other designs on greensheets and other substrates. The method and apparatus utilize a metal containing transfer sheet whereby selected portions of the metal containing transfer sheet are transferred to the greensheet forming the desired circuit pattern and then the transfer sheet removed. The metal containing transfer sheet may contain a release layer. Transfer methods include stamping, hot rolling, laser beam, heat, etc. and combinations thereof The transfer sheet may also have a stratified or graded vertical profile so that different conductivities or other circuit properties (transfer sheet adhesion, etc.) may be obtained in the formed pattern on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.