Selectively coating bond pads
US6403457B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 25, 1999 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Aug 25, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/072
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Solder ball bond pads and wire bond pads may be selectively coated so that the wire bond bond pads have a thicker gold coating than the solder ball bond pads. This may reduce the embrittlement of solder ball joints while providing a sufficient thickness of gold for the wire bonding process. In general, gold coatings are desirable on electrical contact surfaces to prevent oxidation. However, the thickness of gold which is necessary on solder ball bond pads may be less and excessive gold may be disadvantageous. Thus, by masking the solder ball bond pads during the gold coating of the wire bond bond pads, a differential gold thickness may be achieved which is more advantageous for each application.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.