Test contact
US6404216B1 · kind B1 · utility
6Cited by
9References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 26, 1999 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Mar 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor leadframe with an improved test contact is disclosed. Leadframes that are coated with a harder thinner material such as Nickel/Palladium and subsequently plated with a softer and thicker metal test contact, such as gold or silver, is disclosed. The areas that are plated with the test contact are on lead fingers where a test probe would normally contact. The test probe penetrates the softer material much easier allowing for a good contact, thus better testing and burning-in.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.