Wafer centering system and method
US6405101B1 · kind B1 · utility
77Cited by
25References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1999 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Nov 5, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a system and method for detecting the position of a wafer with respect to a calibrated reference position. In one embodiment of the invention, sensors are used to detect the edges of the wafer as the wafer is being passed over the sensors. This wafer detection information is then used to calculate the amount by which the wafer is off-centered such that corrections can be made before the wafer is placed onto a destination location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.