Wafer inspection apparatus
US6405610B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1999 |
| Grant date | Jun 18, 2002 |
| Priority date | — |
| Expiry date | Jun 1, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67766
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
This invention relates to a wafer inspection apparatus having various types of structures for realizing a reduction in convey time of a selected wafer as an inspection target, an improvement in operability, or the like. In particular, this wafer inspection apparatus has a first convey system and a second convey system. The first convey system is movable in a direction perpendicular to a wafer convey reference surface and has a plurality of arm portions operable independently of each other. The second convey system has a plurality of rotary arm portions that are movable in the direction perpendicular to the wafer convey reference surface. Thus, a structure in which the wafer convey time is shorter than in a conventional wafer inspection apparatus is realized. This wafer inspection apparatus also has a lifting unit with a specific structure, thus realizing an improvement in operability of the apparatus or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.