Patent · US Expired

Accurate positioning of a wafer

US6405740B1 · kind B1 · utility

6Cited by
7References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 2, 2000
Grant dateJun 18, 2002
Priority date
Expiry dateAug 2, 2020

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S414/136
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A load station is used in a planarizing machine to perform several useful functions related to handling of a wafer. By centering the wafer with respect to a spindle carrier the load station interrupts the accumulation of positional errors. The load station never makes solid contact with the wafer, but instead the wafer is continually levitated on three cushions of water that are directed upwardly against the lower face of the wafer. The presence of the wafer partially impedes the flow of water from the nozzles used for levitation causing an increase in the water pressure immediately upstream of the nozzles. This increased pressure is sensed and used as an indicator of the presence of a wafer at the load station. The load station further includes a nozzle that directs a stream against the lower side of the wafer so as to elevate the wafer from the load station into the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.