Wafer scale image sensor package
US6407381B1 · kind B1 · utility
186Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2000 |
| Grant date | Jun 18, 2002 |
| Priority date | — |
| Expiry date | Jul 5, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An image sensor package includes an image sensor having bond pads and an active area on an upper surface of the image sensor. The image sensor package further includes a window support on the upper surface of the image sensor. The window support entirely encloses the upper surface including the active area and the bond pads. A window is in contact with the window support, the window overlying the active area. Generally, the window support and the window entirely enclose, and thus protect, the active area of the image sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.