System and method for automatic analysis of defect material on semiconductors
US6407386B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1999 |
| Grant date | Jun 18, 2002 |
| Priority date | — |
| Expiry date | Feb 23, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2561
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and system for automatic EDX analysis of defects quantitatively take into consideration x-ray signals attributable to the background. The method and system are capable of automatically identifying suitable locations for background and defect x-ray sampling. The method and system are also capable of effectively and quantitatively, rather than qualitatively, removing signals attributable to the background and not the defect. One advantageous feature that enables the method and system to have a high throughput is termed “trace element analysis.” The method and system are particularly beneficial for analysis of defects on semiconductor wafers and, due to automation, are suitable for in-line inspection of wafers in the fabrication plant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.