Contact-bumpless chip contacting method and an electronic circuit produced by said method

US6407457B1 · kind B1 · utility

Assignee

• Smart Pac GmbH Technology Services · DE

Inventors

• Rolf Aschenbrenner · Berlin, DE
• Elke Zakel · Falkensee, DE
• Hans-Hermann Oppermann · Berlin, DE
• Ghassem Azdasht · Berlin, DE

Key dates

• Filing date: Nov 1, 2000
• Grant date: Jun 18, 2002
• Expiry date: Nov 1, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic contacting method for contacting a chip having a plurality of conductive contact areas, which are not provided with an additional metallization layer, a carrier substrate is provided, which has a first surface having arranged thereon a plurality of conductive connecting sections. A non-conductive adhesive layer is arranged on the first surface of the carrier substrate and subsequently, the carrier substrate is aligned with a chip to be contacted in such away that a plurality of conductive contact areas on said chip to be contacted is in alignment with the connecting sections on the first surface of said carrier substrate. Then the carrier substrate is connected to the chip to be contacted by means of the adhesive layer in such a way that the connecting sections of the carrier substrate and the contact areas of the chip abut on one another by means of pressure contact, without any intermetallic connection being established.