Electronic package having embedded capacitors and method of fabrication therefor

US6407929B1 · kind B1 · utility

Assignee

• Intel Corporation · US

Inventors

• Aaron Dean Hale · Chandler, US
• Michael Walk · Mesa, US
• David G. Figueroa · Mesa, US
• Joan K. Vrtis · Mesa, US
• Toshimi Kohmura · Shizuoka, JP

Key dates

• Filing date: Jun 29, 2000
• Grant date: Jun 18, 2002
• Expiry date: Jun 29, 2020

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/4913
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic package (302, FIG. 3) includes one or more capacitors (308) embedded within one or more layers (310) of the package. The embedded capacitors are discrete devices, such as integrated circuit capacitors (FIGS. 17-18) or ceramic capacitors. During the package build-up process, the capacitors are mounted (410, FIG. 4) to a package layer, and a non-conductive layer is applied (412) over the capacitors. When the build-up process is completed, the capacitor's terminals (604, 608, FIG. 6) are electrically connected to the top surface of the package. The embedded capacitor structure can be used in an integrated circuit package (1904, FIG. 19), an interposer (1906), and/or a printed circuit board (1908).