Through-chip conductors for low inductance chip-to-chip integration and off-chip connections

US6410431B1 · kind B1 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Claude L. Bertin · Venice, US
• Wayne J. Howell · Williston, US
• William R. Tonti · South Burlington, US
• Jerzy M. Zalesinski · South Burlington, US

Key dates

• Filing date: Dec 19, 2000
• Grant date: Jun 25, 2002
• Expiry date: Dec 19, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19104
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Through-chip conductors for low inductance chip-to-chip integration and off-chip connections in a semiconductor package is disclosed. A semiconductor device has active devices on the front surface, a first through-chip conductor having first electrical/physical characteristics passing from the front surface of the device to the back surface, a second through-chip conductor having second electrical/physical characteristics passing to the back surface, and an off-chip or chip-to-chip connector electrically connecting the active devices on the front surface to a different level of packaging.