System for polishing and cleaning substrates
US6413145B1 · kind B1 · utility
15Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2000 |
| Grant date | Jul 2, 2002 |
| Priority date | — |
| Expiry date | Apr 5, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67766
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The substrate processing system has a factory interface module, a chemical mechanical polisher, a cleaner, a particle monitor and a substrate transfer system disposed as an integrated system. The factory interface module may includes a chamber a storage station located in a chamber of the module to hold a plurality of substrates in a substantially horizontal position. The storage station may hold pad break-in wafers for pad preconditioning and/or monitor wafers for defects monitoring. The particle monitor may have a port coupled to the factory interface module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.