Structure of disturbing plate having down set
US6414379B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2000 |
| Grant date | Jul 2, 2002 |
| Priority date | — |
| Expiry date | Sep 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A disturbing plate structure having at least one down set, applicable in a lead frame-type package in a semiconductor. The disturbing plate has at least a lead frame, a die, a glue layer, a plurality of disturbing plates, a top mold compound, and a bottom mold compound. The lead frame has a plurality of leads. Two disturbing plates are located on two sides of the die. A space is formed by bending a first bent portion and a second bent portion of the disturbing plate down. Finally, the lead frame is encapsulated with a mold compound. By adjusting the size of the space formed by the first bent portion and the second bent portion, the top mold compound section has substantially the same volume as the bottom mold compound section to finish the packaging and forming.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.