Ya-Yi Lai
5Patents
2h-index
11Co-inventors
44Inventor score
Filing activity: Sep 29, 2000 → May 2, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7019389B2 | Lead frame and semiconductor package with the same | Electricity | 13 | Expired |
| US6414379B1 | Structure of disturbing plate having down set | Electricity | 7 | Expired |
| US6642735B2 | Semiconductor package for chip with testing contact pad connected to outside | Electricity | 1 | Expired |
| US9524944B2 | Method for fabricating package structure | Electricity | 1 | Active |
| US9362245B2 | Package structure and fabrication method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.