Method for sample separation and lift-out with one cut
US6420722B2 · kind B2 · utility
131Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2001 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | May 23, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3109
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
When a desired portion is separated from an integrated circuit chip or a semiconductor wafer, the portion is separated so that the resulting sample can be moved to a location for examination by TEM, SEM or other means. A sample portion of the chip or wafer containing an area of interest is separated with a single cut by a focused ion-beam. Prior to separation, the sample is fixed to a micromanipulator probe. The sample is moved by the probe to the location for examination and fixed there. The probe is then detached from the sample by the focused ion-beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.