Method removing residual photoresist
US6422246B1 · kind B1 · utility
1Cited by
8References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 29, 2000 |
| Grant date | Jul 23, 2002 |
| Priority date | — |
| Expiry date | Feb 29, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/30
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for removing residual color photoresist material from a substrate after photoresist development. The method washes the substrate with a high-pressure jet of de-ionized water that contains an activated interface agent. A second method of removing the residual photoresist material bombards the substrate with oxygen plasma for a brief period so that the residual photoresist material is polarized and then rinses the substrate with de-ionized water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.