Method and system for controlling the photolithography process
US6424417B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 1998 |
| Grant date | Jul 23, 2002 |
| Priority date | — |
| Expiry date | Dec 7, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70558
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and a system are presented for automatic optical control of at least one working parameter of a processing tool to be applied to a working area of a workpiece for providing certain process results. The at least one working parameter of the processing tool affects at least one parameter of the workpiece under processing. The processing tool has a preset value of the at least one working parameter prior to the processing of the workpiece. A measuring tool is applied to the workpiece prior to its processing by the processing tool for measuring the at least one parameter of the workpiece and generating measured data representative thereof. The measured data is analyzed with respect to the preset value of the working parameter and to the process results, so as to determine whether the preset value should be corrected for providing the certain process results when applying the processing tool to said workpiece. Upon detecting that the preset value should be corrected, calculating a correction value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.