Polishing head for chemical mechanical polishing using linear planarization technology
US6425812B1 · kind B1 · utility
6Cited by
84References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1999 |
| Grant date | Jul 30, 2002 |
| Priority date | — |
| Expiry date | Dec 30, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing head for performing chemical-mechanical polishing on a linear polisher has a flexible diaphragm coupling between a wafer carrier and a support housing which houses the wafer carrier. The diaphragm allows the carrier to move-substantially in the vertical direction within the housing, but a center shaft assembly limits movement in the horizontal direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.