Electroplating both sides of a workpiece
US6426290B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2000 |
| Grant date | Jul 30, 2002 |
| Priority date | — |
| Expiry date | Jan 13, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of electroplating both sides of a dual-sided circuit board substrate having electrically connected, multi-trace circuit patterns formed on both sides of the substrate, without requiring formation and at least partial removal of electrically conductive tie bars, comprises steps of covering and electrically contacting a first one of the circuit patterns with a first layer of electrically conductive material, applying an electrical potential to the first layer of electrically conductive material to effect electroplating on the second one of the circuit patterns, removing the first layer of electrically conductive material, covering and electrically contacting the second one of the circuit patterns with a second layer of electrically conductive material, applying an electrical potential to the second layer of electrically conductive material to effect electroplating on the first one of the circuit patterns, and removing the second layer of electrically conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.