Edwin Fontecha
8Patents
5h-index
6Co-inventors
42Inventor score
Filing activity: Aug 7, 2000 → Jul 11, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6507100B1 | Cu-balanced substrate | Electricity | 23 | Expired |
| US6448507B1 | Solder mask for controlling resin bleed | Electricity | 16 | Expired |
| US6348142B1 | Electroplating multi-trace circuit board substrates using single tie bar | Electricity | 9 | Expired |
| US6426290B1 | Electroplating both sides of a workpiece | Electricity | 9 | Expired |
| US6432291B1 | Simultaneous electroplating of both sides of a dual-sided substrate | Electricity | 9 | Expired |
| US6857790B2 | Apparatus and method to vertically route and connect multiple optical fibers | Physics | 4 | Expired |
| US6538307B1 | Packaging substrate comprising staggered vias | Electricity | 2 | Expired |
| US6515354B1 | Micro-BGA beam lead connection with cantilevered beam leads | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.