Electronic package and method of making same
US6426565B1 · kind B1 · utility
16Cited by
18References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2000 |
| Grant date | Jul 30, 2002 |
| Priority date | — |
| Expiry date | Mar 22, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15798
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package and method of making the electronic package is provided. An opening in the substrate of the electronic package is formed to substantially prevent adhesive which can bleed from under an electronic device from contacting conductive pads on the substrate. An electrical coupling is formed between the package's electronic device and conductive pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.