Treatment process for molecular bonding and unbonding of two structures
US6429094B1 · kind B1 · utility
24Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 1998 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Aug 25, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/135
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Process for providing separable structures comprising providing at least two structures wherein at least one structure contains a diffusable element contacting said structures under conditions providing molecular bonding of said structures along a bonding interface and heating said bonded structures under conditions causing diffusion of the diffusable element to the bonding interface where said diffusable element interacts with the bonding interface enabling the unbounding of said structures along the bonding interface. This process is useful in the manufacture of devices with integrated circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.