Non-continuous conductive layer for laminated substrates
US6429385B1 · kind B1 · utility
6Cited by
13References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 8, 2000 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Aug 23, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods, memory devices, module boards and systems are disclosed utilizing a non-continuous conductive layer in their circuit board as opposed to a substrate having a continuous length of metal such as copper from one end to the other. By ensuring that a non-continuous conductive layer is no longer present in a substrate, deformation and warping of the substrate or circuit board can be reduced. This can reduce or prevent future errors in processing from occurring due to the tight tolerance required in processing of circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.