High density column grid array connections and method thereof
US6429388B1 · kind B1 · utility
25Cited by
23References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2000 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | May 3, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates generally to a new semiconductor chip carrier connections, where the chip carrier and the second level assembly are made by a surface mount technology. More particularly, the invention encompasses surface mount technologies, such as, Ball Grid Array (BGA), Column Grid Array (CGA), to name a few, where the surface mount technology comprises essentially of a non-solder metallic connection, such as, a copper connection. The present invention is also related to Column Grid Array structures and process thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.