Acoustic 3D analysis of circuit structures
US6430728B1 · kind B1 · utility
8Cited by
13References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1999 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Sep 30, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG10K15/046
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
According to an example embodiment, the present invention is directed to a system and method for analyzing an integrated circuit. A laser is directed to the back side of an integrated circuit and causes local heating, which generates acoustic energy in the circuit. The acoustic energy propagation in the integrated circuit is detected via at least two detectors. Using the detected acoustic energy from the detectors, at least one circuit defect is detected and located.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.