Nozzle for rinsing the backside of a semiconductor wafer
US6434775B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 23, 1999 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Dec 23, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A nozzle includes a body having an entrance location and an exit location. The body has a curved exit surface defined at the exit location. An internal chamber is defined in the body below the curved exit surface and a channel extends between the entrance location and the internal chamber. A slit defines an opening in the curved exit surface. The slit extends from the curved exit surface into the internal chamber. The curved exit surface and the slit are configured to define a fanned spray when liquid flows out of the slit. A method for rinsing the backside of a semiconductor wafer includes the operations of forming a wafer transport truck into a nozzle, and spraying a liquid from the nozzle onto the backside of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.