Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate
US6435492B1 · kind B1 · utility
6Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2000 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Dec 8, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A Die Bonder or Wire Bonder has a suction device for pulling flat and holding down a curved substrate equipped with or to be equipped with a semiconductor chip onto a supporting surface of a plate. The plate contains at least one cavity open towards the supporting surface in which there is a vacuum gripper made out of flexible material, whereby the vacuum gripper is lowerable into the cavity during transport of the substrate and which is raisable above the level of the supporting surface to apply suction to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.