Patent · US Expired

Semiconductor structure having a doped conductive layer

US6436818B1 · kind B1 · utility

104Cited by
35References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 6, 1999
Grant dateAug 20, 2002
Priority date
Expiry dateDec 10, 2019

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D64/664
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Methods and apparatus for forming word line stacks comprise one, or a combination of the following: a silicon diffusion barrier layer, doped with oxygen or nitrogen, coupled between a bottom silicon layer and a conductor layer; an amorphous silicon diffusion barrier coupled between a polysilicon layer and a conductor layer; a thin nitride layer coupled between a bottom silicon layer and a titanium silicide conductor layer, and a bottom silicon layer coupled to a conductor layer, which comprises C54-titanium silicide. Word line stacks formed by the methods of the invention are used in sub-0.25 micron line width applications and have a lower resistivity and improved thermal stability.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.