Chemical mechanical polishing using magnetic force
US6436828B1 · kind B1 · utility
33Cited by
28References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2000 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | May 4, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus includes a carrier head, a platen positioned on an opposing side of the carrier head, and a polishing pad positioned on the platen to contact and polish the substrate received on the substrate receiving surface. The carrier head includes a housing, a flexible membrane attached to the housing and having a substrate receiving surface to receive a substrate. The flexible membrane has magnetically sensitive particles distributed therein. One or more coils are positioned above the flexible membrane to generate magnetic fields to exert magnetic forces on the particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.