Patent · US Expired

Method of manufacturing an interconnector

US6438831B1 · kind B1 · utility

10Cited by
16References
10Claims
0Family size

Assignee

Inventor

Key dates

Filing dateApr 21, 2000
Grant dateAug 27, 2002
Priority date
Expiry dateApr 21, 2020

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/109
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A method of manufacturing an interconnector that is interposed between a pair of terminal plates each having electrodes arranged in a predetermined pattern, for electrically connecting the electrodes of the terminal plates, including arranging positioning plates in a container and inserting conductive wires into through holes of the positioning plates. Then forming a stacked body by alternately forming stacked insulating sheet layers and synthetic resin layers, in the container and thereafter cutting the stacked body at a middle portion of each synthetic resin layer before separating the synthetic resin layers from the insulating sheet layers, thereby forming interconnectors.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.