Sputtering reactor and method of using an unbalanced magnetron
US6440282B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2000 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Jun 30, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3408
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a sputtering device which has a small rotatable magnetron (30) arranged opposite a target 16, the magnetron (30) has a first magnet band (44) and a second magnet opposite a target 16, the magnetron (30) has a first magnet band (44) and a second magnet a greater total magnetic flux. Some of the lines of magnetic flux from the second magnet band (42) pass through the first magnet band (44) and terminate at the second magnet band (42). The remaining lines of magnetic flux from the second magnet band (42) form a magnetic flux loop that encloses the first magnet band (44) and that terminates at the second magnet band (42). The outer band is preferably in an oval shape having a minor axis no smaller than 0.8 of the major axis, and more preferably in a circular shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.