Polymeric compound and resin composition for photoresist
US6440636B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 2, 2000 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Nov 2, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F20/30
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polymeric compound includes at least one monomeric unit of the following formula (I): wherein R1 is a hydrogen atom or a methyl group; and each of R2 and R3 is independently a hydrogen atom or a hydroxyl group. The polymeric compound may include the monomeric unit and at least one monomeric unit selected from monomeric units represented by the following formulae (IIa) and (IIb): wherein R1 is a hydrogen atom or a methyl group; each of R4 and R5 is, for example, a hydrogen atom, a hydroxyl group, an oxo group, or a carboxyl group, wherein R4 and R5 are not concurrently hydrogen atoms; and each of R7 and R8 is independently a hydrogen atom, a hydroxyl group, or an oxo group. The polymeric compound have a high etching resistance in addition to satisfactory transparency, alkali-solubility, and adhesion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.