Semiconductor package based on window pad type of leadframe and method of fabricating the same
US6440779B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2001 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | May 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A new semiconductor packaging technology is proposed for the fabrication of a semiconductor package based on window pad type of leadframe. The proposed semiconductor packaging technology is characterized by the mounting of a window shim having a solid ring portion and a hollowed window portion over the die pad of the leadframe. The window shim is dimensioned in such a manner that the width of the ring portion thereof is larger than the width of the window portion of the die pad of the leadframe, while the width of the window portion of the window shim is smaller than the width of the semiconductor chip. This feature allows one design of the window pad type of leadframe to be universally suited for packaging semiconductor chips of various sizes. Moreover, the incorporation of the window shim additionally allows an increase in the heat-dissipation efficiency of the packaged chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.