Bond wire pressure sensor die package
US6441503B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 3, 2001 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Jan 3, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a substrate. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard wire bond techniques.The resulting array of pressure sensor sub-assemblies is then molded, using a mold tool that closes on three sides of the substrate so that a cavity is formed that is open on the fourth side. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of a cavity or hole in the encapsulant. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the cavity. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.