Dual zone wafer test apparatus
US6441606B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2000 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Nov 11, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer cassette includes a stationary dual-zone temperature control base and a removable wafer cassette top. The top includes a main cassette support structure, onto which wafer test electronics, a test interface connector, a wafer interconnect assembly, a wafer test area, a flex film interconnect, and a wafer chuck with evacuation chamber and electric wafer heater, and at least one rough alignment fixture are mounted. A wafer to be tested is inserted, with a pressure-isolating seal, between the wafer chuck and the wafer test area. The base is a stationary fixed portion which includes a first support compartment, a second support compartment and thermal circuits, each of which includes fluid inlet and outlet connections. The fixed portion further includes a heater interconnect to provide connection and external access for a heater element, as well as a vacuum interconnect line to provide external connection to the evacuation chamber. The first and second support compartments are adjacently spaced, and each contains at least one of each of the thermal circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.