Multistage spin type substrate processing system
US6444029B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 1999 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Jun 23, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/3021
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The system comprises a multistage spin unit having a plurality of compartments stacked vertically in a multistage, a main arm mechanism comprising a wafer holder and driving means for causing the wafer holder to advance and retreat longitudinally, moving the wafer holder up and down along a vertical shaft and turning the wafer holder around the vertical shaft, a spin chuck provided on each of the compartments for holding and spin-rotating the wafer delivered by the main arm mechanism, a cup for surrounding the spin chuck to receive and discharge a treatment solution separated from the substrate by centrifugal force, a shared nozzle for supplying the treatment solution toward the substrate held by the spin chuck in the compartment, a nozzle moving passageway provided along the multistage spin unit for communicating with each compartment to move the shared nozzle therethrough, and a nozzle moving mechanism for moving the shared nozzle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.