Corrosion resistant component of semiconductor processing equipment and method of manufacturing thereof
US6444083B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1999 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Jun 30, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C28/345
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A corrosion resistant component of semiconductor processing equipment such as a plasma chamber includes a metal surface such as aluminum or aluminum alloy, stainless steel, or refractory metal coated with a phosphorus nickel plating and an outer ceramic coating such as alumina, silicon carbide, silicon nitride, boron carbide or aluminum nitride. The phosphorus nickel plating can be deposited by electroless plating and the ceramic coating can be deposited by thermal spraying. To promote adhesion of the ceramic coating, the phosphorus nickel plating can be subjected to a surface roughening treatment prior to depositing the ceramic coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.