Planarizing machines and alignment systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates
US6447369B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 30, 2000 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Sep 18, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D7/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Planarizing machines, alignment systems for planarizing machines, and methods for planarizing microelectronic substrates using mechanical and/or chemical-mechanical planarization. In one aspect of the invention, a planarizing machine for mechanical and/or chemical-mechanical planarization of a microelectronic substrate comprises a table, a planarizing pad, and a substrate carrier. The table can have a support panel and an opening through the support panel. The planarizing pad is on the support panel, and the pad has a window aligned with the opening. The substrate carrier assembly has a carrier head configured to hold a microelectronic substrate and drive system coupled to the carrier head. The carrier head and/or the table are movable relative to each other to rub the substrate against the planarizing pad. The planarizing machine also comprises an alignment assembly having a carriage assembly alignable with the opening and an actuator assembly coupled to the carriage assembly. The carriage assembly can have an emission site configured to be coupled to an optical monitoring system for directing a source light along a light path projecting from the carriage. Additionally, the actuat…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.