Solder mask for controlling resin bleed
US6448507B1 · kind B1 · utility
16Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2001 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Mar 7, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Damage to and short circuiting of bond fingers on a substrate due to die-attach resin bleed is prevented, thereby increasing yield and improving reliability. Embodiments include forming a trough in a solder mask on a substrate between the bond fingers and semiconductor chip to prevent the die-attach resin from reaching the bond fingers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.