Land grid array subassembly for multichip modules
US6449155B1 · kind B1 · utility
22Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2001 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Aug 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multichip module subassembly is disclosed which provides for a heatsink, a thermal interface, a module cap upon which a multichip module is mounted, a land grid array interposer, and an assembly cover. The module cap has shimmed load posts and adjustable brackets for precise alignment and loading of the interposer onto the module. The cover may have a springplate for precise preloading of the interposer onto the multichip module for transportation. The multichip module subassembly is easily used as a field replaceable unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.