Hot plate cooling method and heat processing apparatus
US6450805B1 · kind B1 · utility
18Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2000 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Aug 9, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
In a heat processing apparatus for heating a wafer on a hot plate, a black plate having at least a rear face practically having a color with a JIS lightness of 0V to 4V is positioned above the hot plate. Moreover, cooling air is blown out from nozzles onto the rear face of the hot plate so that the temperature of the hot plate can be cooled rapidly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.