Low angle solvent dispense nozzle design for front-side edge bead removal in photolithography resist process
US6453916B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2000 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Jan 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An edge bead removal system and method is provided that employs a nozzle for applying edge bead removal solvent to an edge bead of a photoresist material layer disposed on a wafer. The nozzle eliminates solvent splash by lowering the angle of dispense to less than 20° as well as providing more degrees of freedom to the nozzle arm adjustments. Adjustment screws and a built-in protractor provide precision in setting the application angle. The nozzle includes a clamp design having a nozzle body clamp which holds the nozzle and a main shaft with a protractor assembly for up and down angle adjustments. A support bracket is coupled to the protractor assembly and allows for pivoting and side to side movement of the protractor assembly and the support bracket with respect to one another. A clamp connects a main arm structure that moves the entire edge bead removal nozzle assembly over the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.