Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas
US6454926B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1997 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Sep 30, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/07
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor workpiece holder used in electroplating systems for plating metal layers, such as copper, onto a semiconductor workpiece. The workpiece holder includes electrodes which extend and are partially submerged in a liquid plating bath. The electrodes have a contact face which bears against the workpiece and conducts current therebetween. The submersible portions of the electrodes are partially covered with a dielectric layer or surface and partially covered with a conductive layer or surface. The conductive surface is preferably spaced from the contact face and placed in direct contact with the plating bath to allow diversion of some of the plating current directly between the electrode and plating bath. Associated methods are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.